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| LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED ARRAY Pb Lead-Free Parts LA38B-68/YG-S2-PF DATA SHEET DOC. NO : REV. DATE : : QW0905-LA38B-68/YG-S2-PF-08 A 14 - May. - 2009 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA38B-68/YG-S2-PF Page 1/6 Package Dimensions 4.2 5.2 8.20.5 3.0 Y 4.0 0.5 TYP 3.30.5 G 2.54TYP 1 2 1 2 LYG2062-PF 3.0 4.0 4.2 5.2 1.5MAX 1/4 0.5 TYP 25.0MIN Y G 1 2 1.0MIN 2.54TYP 1 2 Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA38B-68/YG-S2-PF Page 2/6 Absolute Maximum Ratings at Ta=25 J Ratings Parameter Symbol Y Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature IF IFP PD Ir Topr Tstg 15 50 50 10 -40 ~ +85 -40 ~ +100 G 15 80 50 10 mA mA mW UNIT g A J J Typical Electrical & Optical Characteristics (Ta=25 J ) PART NO MATERIAL Emitted GaAsP/GaP Yellow COLOR Lens Forward Luminous Viewing Peak Spectral voltage intensity angle wave halfwidth @10mA(V) @10mA(mcd) 2c 1/2 length f nm (deg) f Pnm Min. 585 35 30 1.7 1.7 Typ. Min. 2.1 2.1 4.5 3.0 Typ. 12 8.0 70 70 LA38B-68/YG-S2-PF GaP Green White Diffused 565 Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA38B-68/YG-S2-PF Page 3/6 Typical Electro-Optical Characteristics Curve Y CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Relative Intensity Normalize @20mA Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA) Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25J Forward Voltage@20mA Normalize @25J Ambient Temperature(J ) Ambient Temperature(J ) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1.0 0.5 0.0 500 550 600 650 700 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA38B-68/YG-S2-PF Page 4/6 Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Relative Intensity Normalize @20mA Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA) Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25J Forward Voltage@20mA Normalize @25J Ambient Temperature(J ) Ambient Temperature(J ) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directive Radiation Relative Intensity@20mA 1.0 0.5 0.0 500 550 600 650 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA38B-68/YG-S2-PF Page 5/6 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Temp(C) 260 C3sec Max 5 /sec max 260X 120X 2 /sec max Preheat 60 Seconds Max 25X 0X0 50 100 Time(sec) 150 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA38B-68/YG-S2-PF Page 6/6 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 J O 5J &-40JO (10min) (10min) 2.total 10 cycles 5J The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 JO 5J 2.Dwell time= 10 O 1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Solderability Test 1.T.Sol=230 JO 5J 2.Dwell time=5 O 1sec |
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